| 首页 > Canton Fair Data (广交会买家名录) > 广交会买家名录 | |||
| Thermal Interface Material | |||
| 发布时间： 2024-6-28 浏览：4 | |||
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发 布 人：todaytex 发布人电子邮件：1407106692@qq.com 联系网址：http://www.todaytex.com |
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公司：Thermal Interface Material 国家：** 联系人：** 地址： This is an inquiry message about Thermal Interface Material in the 108th China Canton Fair. (这是一条买家关于"Thermal Interface Material"的询盘信息，来自第108届中国广交会。)Inquiry Message (询盘信息) Thermal Interface Material I am looking for a non-silicone based material to replace Bergquist Gap Pad VO Ultra Soft in a current application. I need equivalent or better Thermal Conductivity (1.0 W/m-K) and Hardness as close to a 5 rating on the Shore 00 scale. Contact Info (联系信息) Larry Vergon 32819 Company: Lockheed Martin MFC E-mail: larry.vergon@lmco.com larry.vergon@lmco.com 电话：** 传真： ** 邮箱：** 网址：** 采购本类产品及：** |
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